3M™ Scotch-Weld™ Structural Adhesive Film AF163-2K is a thermosetting, modified-epoxy, structural adhesive film designed for bonding of solid panels and honeycomb sandwich constructions.
3M™ Scotch-Weld™ Structural Adhesive Film AF163-2K is a structural adhesive film which features high bond strength from -67°F to 250°F / 19°C to 121°C, high fracture toughness and high peel strength. It has excellent resistance to high moisture environments before and after curing, with just a short cure time at 225°F / 107°C of 90 minutes. It is capable of low-pressure bonding and vacuum curing. It is x-ray opaque which allows use of x-ray non-destructive inspection (NDI) methods. It has excellent shop open time and a long shelf life.