3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2
- 3M ID B40066386
Details
Highlights
- Designed for 250°F (120°C) cure or 350°F (175°C)
- Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
- Excellent shop handling characteristics
- Excellent pre-bond humidity performance on composite substrates
- Unsupported version available for reticulation
- High-fracture toughness and peel strength
3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 encompasses a family of thermosetting modified epoxy adhesives in film form that provides long-term durability and meets specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.
3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 provides excellent performance with easy-to-use shop handling properties. These adhesive films are available in a variety of weights and carriers to meet a range of needs without imposing excess material costs. With high fracture toughness and peel strength, this product provides a reliable, long-term bond suitable for composites, metals in solid panel and honeycomb sandwich fabrication. It is also compatible with multiple substrates and primers. In addition, 3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 exhibits excellent pre-bond humidity performance on composite substrates.
Specifications
| Adhesive Type | Epoxy Film Adhesive |
| Cure Rate | 1 hr |
| Maximum Cure Conditions (Celsius) | 177 °C |
| Maximum Cure Conditions (Fahrenheit) | 350 null |
| Maximum Operating Temperature (Celsius) | 150 °C |
| Maximum Operating Temperature (Fahrenheit) | 300 null |
| Minimum Cure Conditions (Celsius) | 107 °C |
| Minimum Cure Conditions (Fahrenheit) | 224.6 null |
| Minimum Operating Temperature (Celsius) | -55 °C |
| Minimum Operating Temperature (Fahrenheit) | -67 null |
| Substrate | Metal, Composite |
